1100-H18 aluminum plate for PCB aluminum sheet

Circuit boards are widely used in electronic products and digital products. Circuit boards are composed of circuit layers, thermal insulation layers and substrates.

Pcb circuit board substrate materials are mainly divided into two categories:

1. Organic substrates, including phenolic resin, glass fiber/epoxy resin (FR4), Polyimide, BT/Epoxy, etc.;

2. Inorganic substrates, including inorganic metal substrates (copper substrates, aluminum substrates, etc.), ceramic substrates, etc.

The metal substrate is made of 0.3mm-2.0mm thick metal plate, such as aluminum substrate, iron substrate, copper substrate, epoxy resin prepreg and copper foil, which are thermally composited and pressed. PCB aluminum sheet generally adopts aluminum alloy plate, such as 1100 aluminum plate, 5052 aluminum plate, etc. PCB aluminum plate has good thermal conductivity, electrical insulation performance and mechanical processing performance, which can meet the requirements of later processing.

1100-H18 aluminum plate for PCB aluminum sheet

1100 is industrial pure aluminum, the aluminum content (mass fraction) is 99.00%, and it cannot be strengthened by heat treatment. It has high corrosion resistance, electrical conductivity and thermal conductivity, low density and good plasticity. It can produce various aluminum materials through pressure processing, but its strength is low. Other process properties are basically the same as 1050A. 1100 is usually used to require good forming performance, high corrosion resistance, and does not require high strength, such as food and chemical handling and storage equipment, sheet metal products, hollow hardware processed by drawing and spinning, welding combination keys , reflectors, nameplates, etc.

Performance advantages of PCB aluminum substrate

(1) Good mechanical properties: metal substrates have good mechanical strength and toughness. Solve the brittleness problem of the circuit board of the inorganic material substrate. It is suitable for large-area patch processing, and can also withstand the installation of heavy components. In addition, the dimensional stability and flatness of the metal substrate are its great advantages.

(2) Good heat dissipation performance: Since the metal substrate and the prepreg are in direct contact, they both have excellent heat dissipation performance. When using a metal substrate for SMT processing, it can dissipate the heat generated during SMT processing very well. The heat dissipation capacity of the circuit board depends on the thickness of the metal substrate and the thickness of the resin layer.

(3) Capable of shielding electromagnetic waves: In high-frequency circuits, designers focus on preventing electromagnetic wave radiation. The metal substrate can form a natural protective layer to achieve the purpose of shielding electromagnetic waves.